3
1
Back

FBGA-96, 14.0x8.0mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=28 FBGA-96, 14.0x9.0mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, http://www.latticesemi.com/view_document?document_id=213 Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf LFCSP 8pin thermal pad TSSOP HTSSOP 0.65 thermal pad (http://www.analog.com/media/en/technical-documentation/data-sheets/AD9852.pdf 80-Lead Plastic Thin Quad Flatpack (PF) - 14x14mm body, 9.5mm sq thermal pad with vias HTSSOP, 20 Pin (https://www.holtek.com/documents/10179/116723/sop20-300.pdf), generated with kicad-footprint-generator connector JST XH series connector, B02P-NV (http://www.jst-mfg.com/product/pdf/eng/eNV.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: AE-6410-12A example for new part number: A-41791-0018 example for new part number: 5273-06A example for new mpn: 39-28-904x, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator 2220 Tricolor PLCC-4 LED.

New Pull Request