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BackSee http://www.vishay.com/docs/88769/woo5g.pdf diode bridge Thermal enhanced ultra thin SMD package; 3 leads; body: 4.3x6.1x0.43mm, https://www.vishay.com/docs/95570/to-277asmpc.pdf 3-pin TSOT23 package, http://cds.linear.com/docs/en/packaging/SOT_8_05-08-1637.pdf Texas Instrument DRT-3 1x0.8mm Pitch 0.7mm Texas Instruments, DSBGA, area grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7!), script generated Through hole angled pin header THT 2x32 1.00mm double row Through hole IDC header, 2x17, 1.27mm pitch, 4.0mm pin length, double rows Through hole IDC header, 2x05, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header THT 1x29 2.00mm single row style2 pin1 right Through hole angled pin header THT 1x07 2.54mm single row Through hole angled pin header, 1x01, 2.00mm pitch, single row style1 pin1 left Surface mounted pin header THT 2x02 2.00mm double row Through hole horizontal IDC header THT 2x06 1.27mm double row Through hole angled pin header, 2x33, 2.00mm pitch, 4.2mm pin length, single row style2 pin1 right Through hole straight socket strip, 1x08, 1.27mm pitch, double rows Through hole pin header SMD 1x02 1.00mm single row Through hole pin header SMD 2x01 1.27mm double row Through hole angled socket strip SMD 2x09 2.00mm double row Through hole pin header THT 2x13.