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BackLatch, https://www.neutrik.com/en/product/nc3fav1-0 A Series, 5 pole female XLR receptacle, grounding: separate ground contact connected to trigger, gate jack is normalized\nto +12 V, and sustain voltage is taken from \npot pin 1 x 1 mm, 734-137 , 7 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-105-02-xxx-DV-A, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: AE-6410-07A example for new part number: 22-27-2051, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, BM15B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 6 Pin (https://www.silabs.com/documents/public/data-sheets/Si7020-A20.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 20-Pin Plastic Quad Flat, No Lead Package (UC) - 3x3x0.5 mm Body [HTSSOP], with thermal pad 3x2mm Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument VSON 10 Thermal on 11 3x3mm Pitch 0.5mm VSSOP DCU R-PDSO-G8 Pitch0.5mm VSSOP-8 3.0 x 2.0mm, orientation marker at cathode, https://dammedia.osram.info/media/resource/hires/osram-dam-25688470/SFH%202201%20A01_EN.pdf PhotoDiode, plastic SMD SmatDIL PhotoDiode plastic DIL RM5.08 PhotoTransistor, sidelooker package, RM2.54 PhotoTransistor sidelooker package RM2.54 package for diode bridges, row spacing 7.62 mm (300 mils), see https://www.vishay.com/docs/91361/hexdip.pdf THT DIP DIL PDIP 2.54mm 16.51mm 650mil SMDSocket LongPads 64-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), SMDSocket, SmallPads 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil Socket 24-lead though-hole mounted DIP package, row spacing 5.08mm, pin-spacing 2.54mm, see https://www.vishay.com/docs/66542/to-220-1.pdf TO-220-3 Vertical RM 1.27mm MultiwattF-15 staggered type-1 TO-220-8 (Multiwatt8), Vertical, 2.54mm Pitch Multiwatt 8 TO-220-9, Vertical, RM 2.54mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-3 Vertical RM 1.27mm Multiwatt-7 staggered type-1 TO-220-7 Vertical RM 1.27mm staggered type-2 TO-220-7, Vertical, RM 1.27mm, staggered type-1, see http://www.st.com/resource/en/datasheet/l298.pdf TO-220-15 Vertical RM 10.95mm SOT-93 TO-218-3, Horizontal, RM 5.08mm, see http://cdn-reichelt.de/documents/datenblatt/A400/W005M-W10M_SEP.PDF diode bridge ABS (Diotec), see https://diotec.com/tl_files/diotec/files/pdf/datasheets/abs2.pdf SMD package TO-269AA (e.g. Diode bridge), see http://www.vishay.com/docs/88854/padlayouts.pdf TO-269AA MBS diode bridge package, diameter 9.8mm, pin pitch 15.00mm length 16.5mm width 4.7mm Capacitor C, Disc series.
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