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Bump 4x3 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad.

• 9.769640e+01 1.855000e+01 vertex -9.698088e+01.
• -1.051415e+02 9.695134e+01 9.151071e+00 vertex.

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