Labels Milestones
BackA Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=269, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double rows Surface mounted pin header SMD 1x34 1.00mm single row (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 1x08 1.00mm single row Through hole straight pin header, 2x25, 1.27mm pitch, 4.0mm pin length, single row (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x02, 2.00mm pitch, 6.35mm socket length, single row style2 pin1 right Through hole straight pin header, 1x34, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 12.0mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled socket strip, 1x39, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header SMD.
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- -5.855475e-01 3.154248e-04 vertex -1.033298e+02 9.485338e+01 4.255000e+01.