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System, 55932-0410, with PCB locator, 8 Pins (http://www.molex.com/pdm_docs/sd/559320530_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP, 20 Pin (JEDEC MO-153 Var AET Pkg.Code U28E-4 https://pdfserv.maximintegrated.com/package_dwgs/21-0108.PDF), generated with kicad-footprint-generator Hirose DF12E SMD, DF12E3.0-20DP-0.5V, 20 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF11-16DP-2DSA, 8 Pins (http://www.molex.com/pdm_docs/sd/559320210_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 16 Pin (https://www.haloelectronics.com/pdf/discrete-ultra-100baset.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 4 times 0.127 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 3.9mm, size source.

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