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Bump 2x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A Zynq-7000 BGA, 20x20 grid, 17x17mm package, 0.8mm pitch.

• Banana panel socket, through-hole, row spacing.
• 0.000107246 0.115912 0.993259 facet normal.
• Diameter 10mm Electrolytic Capacitor.
• Header, 2x19, 1.00mm pitch, 2.0mm pin length.

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