Labels Milestones
BackGaps reduce heat conduction during soldering ground plane Binary files /dev/null and b/3D Printing/Panels/Radio_shaek_standoff_thick.stl differ Binary files /dev/null and b/Panels/label_test.stl differ surface("FireballSpellVertSmaller.png", center=true, invert=false); Binary files /dev/null and b/Panels/title_test_18.stl differ Binary files /dev/null and b/Panels/luther_triangle_vco_quentin_v3_blank.stl.stl differ Binary files /dev/null and b/sr1_full.png differ aac0a4a5b4 Notes from debugging Notes from MK's PCB livestream - avoid non-circular holes in footprints whenever possible; some fabs charge more for ovals PCB layout: [front](Docs/precadsr_layout_front.pdf), [back](Docs/precadsr_layout_back.pdf) * [BOM](Docs/precadsr_bom.md) * [Build notes](Docs/build.md) How to use for rounding teh top edge. [mm] top_rounding_radius = 8; // mm from very top/bottom edge and where it is not a party to be able to add picture 9f9f6acf76 Add notes about UX component wiring Add notes about wiring SW15 cross-board UI: 11 potentiometers 11 SPDT switches 1 rotary switch to disable reset.
- 4.232404e-001 0.000000e+000 vertex -5.493214e+000 -1.330315e+000.
- Synth_power_2x5 | 2x5 pin shrouded header 2.54 mm.