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16 ============================================================= Total unplated holes count 16 Not plated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes T5 15.200mm 0.5984" (1 hole Total plated holes count 16 Not plated through holes are merged with plated holes unplated through holes: merged pull request 'More schematics' (#3) from schematic into main 26b0f01955 Fix for component clearance, panel thickness from printer realities L1 2 keahS oidaR 32ded0979b Fix rail clearance = ~11.675mm, top and bottom mountSurfaceHeight = (panelOuterHeight-panelInnerHeight-railHeight*2)/2; panelInnerOffset = (panelOuterHeight-panelInnerHeight)/2; echo("railHeight: ", railHeight); echo("mountSurfaceHeight",mountSurfaceHeight); offsetToMountHoleCenterY=mountSurfaceHeight/2; offsetToMountHoleCenterX = hp - holeOffset; // 1 hp from side to center of package, Thorlabs photodiodes, https://www.thorlabs.de/drawings/374b6862eb3b5a04-9360B5F6-5056-2306-D912111C06C3F830/FDGA05-SpecSheet.pdf TO-92 leads molded, wide, drill 0.75mm (https://www.diodes.com/assets/Package-Files/TO92S%20(Type%20B).pdf TO-92S package, 2-pin, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf SSOP56: plastic shrink small outline package; 28 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf SSOP16: plastic shrink small outline package; 18 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf HTSSOP, 38 Pin (JEDEC MO-153 Var CA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator JST SH series connector, 502585-1070 (http://www.molex.com/pdm_docs/sd/5025850270_sd.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, LY20-30P-DT1, 15 Circuits (https://www.molex.com/pdm_docs/sd/2005280150_sd.pdf), generated.

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