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7 removed (Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Quad Flat, No Lead Package - 3x3 mm Body with Exposed Pad (see https://www.diodes.com/assets/Datasheets/AP2204.pdf SSOP 0.50 exposed pad (http://cds.linear.com/docs/en/datasheet/34301fa.pdf SSOP 0.65 exposed pad Micrel MLF, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4320fb.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SSOP48: plastic shrink small outline package; 18 leads; body width 4.4 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf STC SOP, 16 Pin (https://www.st.com/resource/en/datasheet/stspin220.pdf), generated with kicad-footprint-generator Hirose DF63 through hole, DF11-16DP-2DSA, 8 Pins per row (https://www.hirose.com/product/document?clcode=&productname=&series=DF11&documenttype=Catalog&lang=en&documentid=D31688_en), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-146-02-xxx-DV-LC, 46 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator JST EH horizontal JST XH series connector, LY20-16P-DT1, 8 Circuits (https://www.molex.com/pdm_docs/sd/2005280080_sd.pdf), generated with kicad-footprint-generator JST XH series connector, S05B-ZESK-2D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-137-02-xxx-DV-BE-LC, 37 Pins per row (http://www.molex.com/pdm_docs/sd/530480210_sd.pdf), generated with kicad-footprint-generator Harwin Male Horizontal Surface Mount Tactile Switch with Pegs, https://www.ckswitches.com/media/1462/pts125.pdf Button Tactile Switch SPST Slide 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon PLCC, 20 pins, dual row female, vertical entry, strain relief clip Harwin LTek Connector, 16 pins, pitch 5mm, size 25x9mm^2, drill diamater 1.15mm, pad diameter 2.4mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0830, 8 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf.

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