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BackAssembly. As usual do the lowest components first — resistors and diodes — then sockets, ceramic capacitors, power header, transistors, film caps, electrolytic caps... Something like that. Latest commits for file Panels/luther_triangle_vco_quentin_v4.scad Replaced accidentally dropped Fine tuning hole. Am totally not using git correctly Futura BT font files ... Delete 'Panels/futura medium condensed bt.ttf' Panels/futura medium bt.ttf | Bin 0 -> 11675 bytes .../FIREBALL VCO.png | Bin 0 -> 11692 bytes .../HOLD PORTAL.png | Bin 0 -> 317907 bytes Images/PXL_20210831_004139245.jpg | Bin 10724 -> 0 bytes Notes: Before producing, confirm footprint dimensions for capacitors, diodes (inc. LEDs), and barrel.
- (see NXP sot054_po.pdf TO-92 horizontal, leads molded, narrow.
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- 0.758285 0.194199 vertex 7.15159 7.15159 2.58057 vertex 7.20568.
- 100644 Panels/title_test_22.stl Binary files a/3D.
- 3.171 1.743 (end 3.171.