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BackHttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 2x4 (perimeter) array, NSMD pad definition Appendix A Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition Appendix A BGA 676 1 FF676 FFG676 FFV676 Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Surface mounted pin header SMD 1x15 1.27mm single row style1 pin1 left Surface mounted pin header THT 2x21 2.00mm double row surface-mounted straight pin header, 2x40, 1.00mm pitch, double rows Through hole pin header SMD 1x14 1.00mm single row style2 pin1 right Through hole angled socket strip SMD 1x10 2.00mm single row style2 pin1 right Through hole angled pin header SMD 2x31 1.27mm double row SMD IDC box header 2x04 2.54mm double row Through hole angled pin header SMD 1x37 2.54mm single row Surface mounted socket strip SMD 1x29 2.54mm single row Through hole angled socket strip, 2x38, 1.27mm pitch, double rows Surface mounted pin header THT 2x37 1.27mm double row Through hole angled pin header THT 1x36 1.27mm single row (from Kicad 4.0.7), script generated Through hole.
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