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J5, J12, J13 | 3 | 1k | Resistor | | R24, R26, R28 | 3 Hardware/Panel/precadsr-panel/fp-lib-table | 1 | Conn_01x10 | Pin header, 2.54 mm, 1x4 Pin header, 2.54 mm, 1x7 | | | | | | | | | | | | | | | C2 | 1 | AudioJack2_SwitchT | Audio Jack, 2 Poles (Mono / TS *(optional) SIP socket, 2.54 mm, 1x4 Light emitting diode Push button switch, generic, two pins K switch dual double-pole single-throw OFF-ON D Single Pole Single Throw (DPST) Switch, temperature dependent K temerature switch dual double-pole single-throw OFF-ON D Single Pole Single Throw (SPST) switch, small symbol D 3x DIP Switch, Single Pole Single Throw (SPST) switch D Switch, three position, dual pole double throw K switch normally-closed pushbutton push-button LED D MEC 5G single pole double throw, right angle, http://spec_sheets.e-switch.com/specs/P040042.pdf E-Switch sub miniature slide switch, OS series, SPDT, https://www.e-switch.com/wp-content/uploads/2022/06/EG.pdf tactile switch, 7.3mm x 6.25mm package, pitch 0.8mm TFBGA-121, 11x11 raster, 10x10mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf UFBGA-169, 13x13 raster, 7x7mm package, pitch 0.5mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f303zd.pdf WLCSP-100, 10x10 raster, 4.618x4.142mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15 raster, 10x10mm package, pitch 0.8mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f411vc.pdf WLCSP-49, 7x7 raster, 2.999x3.185mm package, pitch 0.65mm WLP-4, 2x2 raster, 0.73x0.73mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f207vg.pdf VFBGA-49, 7x7, 5x5mm package, pitch 0.5mm; see section 6.1 of http://www.st.com/resource/en/datasheet/stm32f405og.pdf WLCSP-100, 10x10 raster, 4.201x4.663mm package, pitch 0.4mm; see section 10.3 of https://www.parallax.com/sites/default/files/downloads/P8X32A-Propeller-Datasheet-v1.4.0_0.pdf 44-Lead Plastic Quad Flat, No Lead Package (MA) - 2x2x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049CH.pdf SC-74, 6 Pin (https://www.jedec.org/sites/default/files/docs/Mo-178c.PDF variant AB), generated with kicad-footprint-generator ipc_gullwing_generator.py SSOP18: plastic shrink small outline package; 8 leads; body width 4.4 mm; (see NXP sot054_po.pdf TO-92 leads molded, narrow, drill 0.75mm (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Horizontal RM 2.54mm TO-218-2, Horizontal, RM 0.97mm, Multiwatt-9, staggered type-1 TO-220-9 Vertical 2.54mm Pitch Multiwatt.

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