3
1
Back

Pin (http://www.ti.com/lit/ds/symlink/ldc1312.pdf#page=62), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 52 Pin (JEDEC MS-012AB, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_14.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SSOP18: plastic shrink small outline package; 44 leads; body width 4.4 mm; Exposed Pad Variation; (see NXP sot054_po.pdf TO-92 leads molded, narrow, drill 0.75mm, hand-soldering variant with enlarged pads.

New Pull Request