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Review Fireball/Fireball.kicad_pro | 6 From f51b7b97734e404127fa5d5d263acbfd66f116e4 Mon Sep 17 00:00:00 2001 45c41b9873 Go to file 007cc05932 Checkpoint after tweaking footprints some more, starting over Fireball/Fireball.kicad_sch | 6 From f51b7b97734e404127fa5d5d263acbfd66f116e4 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Delete '3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/PRISMATIC SPHERE.png Normal file View File MK_VCO_RADIO_SHAEK_try2_ground_rail.diy Executable file View File Schematics/Rampage_V1_4_Sch.pdf Normal file View File Schematics/Baby8_Part4_Cascading.pdf Normal file Unescape Hardware/PCB/precadsr/precadsr.pro Normal file Unescape Schematics/SynthMages.pretty/PinSocket_1x02_P2.54mm_Vertical.kicad_mod Normal file Unescape // 10 LEDs - one per step // 1 to 4.9 milli Ohm (http://http://www.vishay.com/docs/30108/wsk.pdf Power Metal Strip Wire Horizontal pin pitch 44.60mm diameter 49.3mm Vishay TJ8 L_Toroid, Vertical series, Radial, pin pitch=5.00mm, , diameter=12.0mm, Neosid, SD12k, style2, http://www.neosid.de/produktblaetter/neosid_Festinduktivitaet_Sd12k.pdf Inductor Radial series Radial pin pitch 10.00mm length 11.0mm solder Pin_ with flat fork solder Pin_ with flat fork solder Pin_ press fit solder Pin_ with flat fork, hole diameter 1.5mm THT pad as test point, loop diameter 3.8mm, hole diameter 0.9mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py 8-Pin ePad 3mm x 3mm MLF - 3x3x0.85 mm Body [QFN]; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f051t8.pdf WLCSP-36, 6x6 raster, 2.61x2.88mm package, pitch 0.4mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289, NSMD pad definition (http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf UCBGA-36, 6x6 raster, 2.605x2.703mm package, pitch 0.8mm; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition Appendix A Artix-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition Appendix A BGA 324 0.8 GateMate FPGA Maxim WLP-12, W121H2+1, 2.008x1.608mm, 12 Ball, 4x3 Layout, 0.4mm Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic Small Outline (ST)-4.4 mm Body with Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Thin Shrink Small Outline (SM) - 5.28 mm Body [TQFP] (see Microchip datasheet http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf MLF, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF (T2044-5C)), generated with kicad-footprint-generator.

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