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Connector, M20-7811245, 12 Pins per row (http://www.molex.com/pdm_docs/sd/022035035_sd.pdf), generated with kicad-footprint-generator connector JST EH series connector, 505405-1370 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 5, Wuerth electronics 9775106960 (https://katalog.we-online.com/em/datasheet/9775106960.pdf), generated with kicad-footprint-generator JST PH series connector, S13B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP8: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; Exposed Pad Variation; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 44 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf 24-Lead Plastic QFN (3mm x 2mm) (see Linear Technology DFN_14_05-08-1708.pdf DFN14, 4x4, 0.5P; CASE 506CM (see ON Semiconductor 506CE.PDF DD Package; 12-Lead Plastic DFN (2mm x 3mm) (see Linear Technology DFN_16_05-08-1732.pdf DHC Package; 18-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_10_05-08-1722.pdf DFN, 10 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00001725D.pdf (Page 12)), generated with kicad-footprint-generator Hirose DF13C SMD, CL535-0407-6-51, 7 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Samtec HLE .100.

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