Labels Milestones
Back.../fastestenv_Panel_Mounting_Hole.kicad_mod | 17 ...osmo_Panel_Slotted_Mounting_Hole.kicad_mod | 23 .../SolderWirePad_1x01_Drill0.8mm.kicad_mod | 19 .../SolderWirePad_1x01_Drill1mm.kicad_mod | 19 .../SolderWirePad_1x01_Drill1mm.kicad_mod | 19 .../ao_tht.pretty/TO-92_Inline_Wide.kicad_mod | 36 Schematics/Fireball.kicad_sch | 400 (50 "User.1" user (51 "User.2" user (52 "User.3" user (53 "User.4" user (54 "User.5" user (55 "User.6" user (56 "User.7" user (57 "User.8" user (58 "User.9" user Component Count: 77 Refs 3 pin Molex connector 2.54 mm 2x5 | | | C2 | 1 | 4.7 uF | Unpolarized capacitor | | U2 | 1 | B10k | \*\*Potentiometer, 16 mm pots had long enough terminals, barely, to poke through the board, connecting a trace on one side to center of package, Thorlabs photodiodes, https://www.thorlabs.de/drawings/374b6862eb3b5a04-9360B5F6-5056-2306-D912111C06C3F830/FDGA05-SpecSheet.pdf TO-92 leads molded, narrow, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf SSOP56: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 24 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf 24-Lead Plastic QFN (3mm x 2mm) (see Linear Technology 05081707_A_DHD16.pdf DH Package; 16-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline Package (MS) [MSOP], variant of 8-Lead Plastic SO, Exposed Die Pad (see https://www.diodes.com/assets/Package-Files/SO-8EP.pdf 20-Lead Plastic Thin Quad Flatpack (PT) - 12x12x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf DFN, 10 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-10/CP_10_9.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0930, 9 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, old mpn/engineering number: 5566-22A2, example for new part number: A-41792-0002 example for new part number: 22-27-2121, 12 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Connector Phoenix Contact connector footprint for: MCV_1,5/4-G-3.5; number of pins: 07; pin pitch: 5.08mm; Angled; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x4.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1847712 8A 320V Generic Phoenix Contact connector footprint for: MSTB_2,5/4-GF-5,08; number of pins: 12; pin pitch: 7.62mm; Angled; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x4.5 C or ISO 7049-ST 2.2x4.5 C or ISO 7049-ST 2.2x4.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1843648 8A 160V Generic Phoenix Contact connector footprint for: MC_1,5/2-G-5.08; number of pins: 11; pin pitch: 3.81mm; Angled.
New Pull Request