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DFN, 4 Pin (http://www.vishay.com/docs/83510/tcmt1100.pdf), generated with kicad-footprint-generator Resistor SMD 2816 (7142 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 22-27-2121, 12 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 32-Leads, Body 5x5x0.8mm, Pitch 0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_8_6.pdf LFCSP 8pin Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments EUW 7 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, single row Surface mounted socket strip SMD 2x28 2.00mm double row Through hole angled socket strip THT 2x05 2.00mm double row Through hole socket strip SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, bridged with 1 copper strip SMD 1x22 1.00mm single row style1 pin1 left Surface mounted socket strip SMD 1x39 1.27mm single row style1 pin1 left Surface mounted socket strip THT 2x32 2.00mm double row Through hole straight socket strip, 2x34, 2.00mm pitch, double rows Through hole straight socket strip, 2x08, 2.00mm pitch, double rows Through hole angled socket strip, 2x10, 2.00mm pitch, single row Through.

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