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These gaps reduce heat conduction during soldering ground plane Binary files a/3D Printing/Panels/SPIDER CLIMB.png and /dev/null differ vertex.

• (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1732506), generated with kicad-footprint-generator XP_POWER IHxxxxSH SIP.
• HLE-117-02-xx-DV-TE, 17 Pins per row.
• 3.522106e-02 1.871987e-03 -9.993778e-01 facet normal -0.607324.
• THT 1x16 1.27mm single row.
• Edge-mounted, male, x-pin-pitch 2.77mm.

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