3
1
Back

Relays, DPDR, Pitch 3.2mm, http://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Specification+Or+Standard%7F108-98001%7FV%7Fpdf%7FEnglish%7FENG_SS_108-98001_V_IM_0614_v1.pdf%7F4-1462039-1 AXICOM IM-Series Relay DPDT FRT5 narrow footprint, SMD version of bornier2 simple 3-pin terminal block, pitch 5.08mm, size 30.5x8mm^2, drill diamater 1.6mm, 4 pads, pad diameter 2.6mm, see http://www.mouser.com/ds/2/324/ItemDetail_1935161-922578.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block Metz Connect Type101_RT01605HBWC, 5 pins, single row style1 pin1 left Surface mounted socket strip THT 2x01 2.54mm double row Through hole IDC header, 2x25, 1.27mm pitch, 4.0mm pin length, single row style1 pin1 left Surface mounted socket strip THT 2x11 2.54mm double row Through hole angled pin header SMD 1x06 2.00mm single row Through hole straight pin header, 2x02, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x34, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x12, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole IDC header, 2x10, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x38, 1.27mm pitch, single row male, vertical entry, with latches, PN:G125-MVX2005L1X Harwin Gecko Connector, 12 pins, pitch 5mm, size 12.3x14mm^2, drill diamater 1.3mm, pad diameter 3mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST PH series connector, SM10B-SHLS-TF (http://www.jst-mfg.com/product/pdf/eng/eSHL.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WSON, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4440fb.pdf#page=13), generated with kicad-footprint-generator Soldered wire connection, for 5 times 0.5 mm² wires, reinforced insulation, conductor diameter 0.9mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py VQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/bq24133.pdf#page=40 Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition Appendix A Artix-7 BGA, 26x26 grid.

New Pull Request