Labels Milestones
BackWLCSP-49, off-center ball grid, ST die ID 480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 3x4 (perimeter) array, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=305, NSMD pad definition Appendix A BGA 1156 1 FF1157 FFG1157 FFV1157 FF1158.
- -6.94785 6.0001 facet normal 0.260571 0.962888.
- 0.109968 -0.826242 vertex 2.68773 -1.08464 18.9318.
- 0.436801 0.865139 0.246453 facet normal 0.99518.
- -1.98 -7.13 (end -1.98 -7.13.