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Pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition Appendix A BGA 1760 1 FH1761 FHG1761 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Surface mounted socket strip THT 2x03 2.54mm double row Through hole pin header SMD 1x06 1.00mm single row style1 pin1 left Surface mounted pin header THT 1x30 1.00mm single row style2 pin1 right Through hole angled pin header THT 1x09 1.27mm single row Surface mounted socket strip SMD 2x39 2.54mm double row Through hole angled socket strip SMD 2x14 1.00mm double row Through hole angled pin header THT 1x08 2.00mm single row Through hole pin header THT 1x33 1.00mm single row Through hole straight Samtec HPM power header series 11.94mm post length, 1x02, 5.08mm pitch, single row (from Kicad 4.0.7), script generated Surface mounted socket strip THT 1x29 2.00mm single row male, vertical entry Harwin LTek Connector, 6 pins, pitch 5mm, size 82.3x14mm^2.

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