Labels Milestones
BackInstruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=277, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=296, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=91, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf.
- For QRE1113, see https://www.onsemi.com/pub/Collateral/QRE1113-D.PDF.
- File Unescape Hardware/Panel/precadsr_panel_al_Gerbers/precadsr_panel_al-B_SilkS.gbr Normal file Unescape Hardware/PCB/precadsr/ao_tht.pretty/SOT-23_Handsoldering.kicad_mod Normal.
- OffsetToMountHoleCenterX); module eurorackPanel(panelHp, jackHoles, holeCount, holeWidth.
- -0.343415 0.642334 vertex -4.77601 -4.54597 7.16505.