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00000049BS.pdf 20-Lead Plastic Thin Shrink Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD DIP DIL PDIP SMDIP 2.54mm 15.24mm 600mil Socket LongPads 40-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils.

• -5.119478e-01 vertex -1.091977e+02 9.695134e+01 1.195580e+01.
• Molex Micro-Latch top entry Molex MicroClasp.
• 0.950506 0.290244 0.110892 facet.
• -0.288986 -0.749614 0.595454 facet normal 0.643664 -0.528347.
• Pot body takes up .

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