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BackTSSOP10: plastic thin shrink small outline package; 24 leads; body width 4.4 mm (see NXP sot054_po.pdf TO-92 horizontal, leads in-line, wide, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf 24-Lead Plastic Shrink Small Outline No-Lead 8-Lead Plastic Dual Flat, No Lead Package (8E) - 4x4x0.9 mm Body [LFCSP]; (see https://www.intersil.com/content/dam/Intersil/documents/l72_/l72.10x10c.pdf LFCSP VQ, 24 pin, exposed pad: 4.5x8.1mm, with thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 506CN.PDF DC8 Package 8-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_8_05-08-1698.pdf DFN, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29), generated with kicad-footprint-generator JST SUR series connector, 505405-0470 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py VQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/ina3221.pdf#page=44), generated with kicad-footprint-generator JST ZE series connector, B20B-PUDSS (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-140-02-xxx-DV-BE-LC, 40.
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