3
1
Back

Transistor TO-92Mini package, drill 0.6mm (https://media.digikey.com/pdf/Data%20Sheets/Infineon%20PDFs/KT,KTY.pdf TO-92S package, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf SSOP56: plastic shrink small outline package; 28 leads; body width 4.4 mm; Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf HSOP, 8 Pin (http://www.ti.com/lit/ds/symlink/tps62823.pdf#page=29), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP, 64 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ad7606_7606-6_7606-4.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, BM05B-ZESS-TBT (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator JST PH top entry Samtec.

New Pull Request