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BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.5mm Pitch.

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• Plastic near cylindrical package Sod-70 see: https://www.nxp.com/docs/en/data-sheet/KTY81_SER.pdf [StepUp.

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