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Type011_RT05504HBWC, 4 pins, pitch 5mm, size 25x12.5mm^2, drill diamater 1.3mm, pad diameter 2.6mm, see http://www.farnell.com/datasheets/100425.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block 4Ucon ItemNo. 10703, vertical (cable from top), 9 pins, pitch 2.54mm, size 8.08x6.5mm^2, drill diamater 1.2mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00067_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block RND 205-00059, 45Degree (cable under 45degree), 10 pins, pitch 5mm, size 15x12.5mm^2, drill diamater 1.1mm, pad diameter 2mm, outer diameter 2.7mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-138-02-xxx-DV-BE, 38 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 0.15 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for a 1uF capacitor; expand a bit, but also size it for a full bridge rectifier; could use fewer caps that way ttrss-plugin- _comics/README.md 3 lines bd1352a047 Fix annoyance of 2x05 IDC header triangle being so far out Add polygon calculation for wing plates 5cacbfea2e523d618ea3bcbc0bca9c37eb36f10d Update README.md 3d0ca7fdf6e2ad8d7864221e585c668e46544055 Update README.md 3e868f13c4dc33c20ca33a0cc8f51c9d63e1c081 updated C14 footprint, traces, groundplane updated C14 footprint, traces, groundplane 2cbdb94ba9 updated C5 footprint & tracing; schematic annotation 2cbdb94ba94f485ce4abcb1f14e2e5f15d016647 updates the potentiometer pads and thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Shrink Small Outline (ST)-4.4 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 9x-dip-switch SPST , Slide, row spacing 25.4 mm (1000 mils), SMDSocket, SmallPads 16-lead though-hole mounted DIP package, row spacing 26.67 mm (1050 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 12-lead though-hole mounted DIP package, row spacing.

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