3
1
Back

Body, 1.60mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/ACS780-Datasheet.ashx Allegro Microsystems 24-Lead Plastic QFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (4mm x 3mm) (see Linear Technology DFN_6_05-08-1703.pdf 6-Lead Plastic DFN (2mm x 3mm) (see Linear Technology DFN_16_05-08-1732.pdf DHC Package; 16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad with vias HTSSOP, 20 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_20_05-08-1711.pdf), generated with kicad-footprint-generator JST SHL series connector, 64800911622 (https://katalog.we-online.com/em/datasheet/6480xx11622.pdf), generated with kicad-footprint-generator Molex Pico-Clasp top entry JST AUH series connector, 64800411622 (https://katalog.we-online.com/em/datasheet/6480xx11622.pdf), generated with kicad-footprint-generator Connector Phoenix Contact connector footprint for: MSTBV_2,5/6-GF-5,08; number of pins: 02; pin pitch: 7.62mm; Angled; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x6.5 C.

New Pull Request