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Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 64-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 6.7x16.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 4x-dip-switch SPST KingTek_DSHP04TJ, Slide, row spacing 22.86 mm (900 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size 6.7x32.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf E-Switch slide switch.

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