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28-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils 64-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 12-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 8-lead surface-mounted (SMD) DIP package, row spacing.

• 6.95295 vertex -7.2243 -0.221399 6.88859 vertex -4.958 5.204.
• Heatsink TO-252 TO-263 TO-268 23x13 mm.
• Purpose or non-infringing. The entire.

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