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POE 10/100/1000 Base-T RJ45 single port with LEDs and 75W POE, https://productfinder.pulseeng.com/doc_type/WEB301/doc_num/J432/doc_part/J432.pdf RJ45 8p8c ethernet POE 10/100/1000 Base-T Transformer Module, PT61020EL (https://www.bourns.com/pdfs/PT61020.pdf Gigabit PoE Ethernet Transformer Single SMD RF transformer, 50 ohm, 4.5 to 3000Mhz, https://www.minicircuits.com/pdfs/TC1-1-13M+.pdf WE-AGDT Auxiliary Gate Drive Transformer, 1:1:1, 11.8x8.8x4.0mm (https://productfinder.pulseeng.com/products/datasheets/P663.pdf SMT Gate Drive Transformer, 1.25:1, 10.9x9.7x2.7mm (https://productfinder.pulseeng.com/products/datasheets/SPM2007_61.pdf Current sense transformer, SMD, 8.0x8.13x5.3mm (https://www.coilcraft.com/pdfs/cst.pdf Transformer current sense SMD 8.4x7.2mm Ethernet Transformer, Bel S558-5999-T7-F, https://www.belfuse.com/resources/ICMs/lan-/S558-5999-T7-F.pdf Transformer Ethernet Single Center-Tap Transformer Ethernet SMD, https://www.haloelectronics.com/pdf/discrete-genesus.pdf Halo N2 SO, 16 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ADXL363.pdf#page=44 MS5837 Ultra-small gel-filled pressure sensor automotive honeywell Pressure Sensor, Dual-Barbed, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=MS5525DSO&DocType=DS&DocLang=English LEM LV25-P Voltage transducer, https://www.lem.com/sites/default/files/products_datasheets/lv_25-p.pdf LEM Hall Effect Voltage transducer 3M 40-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 4x-dip-switch SPST Copal_CHS-04B, Slide, row spacing 7.62 mm (300 mils), Socket 64-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 8-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size 6.7x4.1mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 11x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils Analog BGA-28 4.0mm x 6.25mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf UFBGA-169, 13x13 raster, 7x7mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf UCBGA-36, 6x6 raster, 2.5x2.5mm package, pitch 0.8mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf WLCSP-81, 9x9 raster, 4x4mm package, pitch 0.8mm Altera BGA-68 M68 MBGA Altera BGA-153 M153 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 7.62 mm (300 mils), body size 6.7x21.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 4x-dip-switch SPST Omron_A6H-4101, Slide, row spacing 26.67 mm (1050 mils), SMDSocket, SmallPads 10-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 22-lead surface-mounted (SMD) DIP package, row spacing.

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