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Texas instruments QFN Package, datasheet: https://www.ti.com/lit/ds/symlink/tpsm53602.pdf Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 484 0.8 CLG484 CL484 CLG485 CL485 Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270, NSMD pad definition Appendix.

• 1.553702e-003 7.524713e-001 vertex -4.097424e+000 1.590920e+000.
• 100644 Envelope/Envelope.kicad_pro create mode.
• -0.23878 18.7299 vertex 4.43928 -0.247977 18.7299.

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