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X="3.7" y="2.5"/> Update luther's layout Drill report for precadsr-panel.kicad_pcb Created on Tue Mar 5 20:19:51 2024 Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes are merged with plated holes Total unplated holes count 16 ============================================================= Total unplated holes count 16 ============================================================= Total unplated holes count 0 Minor layout.

Pattern of a Secondary.
Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP.
Contacts AT ISA 16 bits Bus Edge Connector.
DLG-1004 unshielded SMD power package (https://www.microsemi.com/packaging-information/partpackage/details?pid=5341 Microsemi.
(https://katalog.we-online.de/em/datasheet/9774060243.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py VQFP, 128 Pin.

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