Labels Milestones
BackPin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=425), generated with kicad-footprint-generator Hirose DF11 through hole, DF11-16DP-2DSA, 8 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py TDFN, 12 Pads, No exposed, http://www.st.com/resource/en/datasheet/stm6600.pdf TDFN, 14 Pin (https://m.littelfuse.com/~/media/electronics/datasheets/tvs_diode_arrays/littelfuse_tvs_diode_array_sp3012_datasheet.pdf.pdf#page=7), generated with kicad-footprint-generator Molex Mini-Fit Sr. Power Connectors, 105313-xx02, 2 Pins per row (http://www.molex.com/pdm_docs/sd/460071105_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 40 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-40/CP_40_15.pdf), generated with kicad-footprint-generator Net tie, 3 pin, 2.0mm square SMD pads Net tie, 3 pin, 0.3mm round THT pads Net tie, 2 pin, 0.5mm square SMD pads Net tie, 2 pin, 2.0mm square SMD pads Net tie, 2 pin, 0.5mm square SMD rectangular pad as test Point, square 2.0mm side length SMD rectangular pad as test Point, square 1.5mm side length, hole diameter 1.85mm wire loop as test Point, diameter 1.5mm, size source Multi-Contact FLEXI-E 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection, for a label // internal clock rate. Arrasta Playbook REP: repique CAX: caixa MSD: mid surdo (sometimes MS1, MS2, etc, if multiple measures or has planned variations) BSD: back surdo (L for low, H for high R/L Accented note (right/left hand suggested)