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Mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG SSOP20: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline.

• -0.288955 -0.952359 0.0975571 vertex -1.75581.
• 100644 Hardware/Panel/precadsr-panel-Gerbers/precadsr-panel-EdgeCuts.gm1 create mode 100644 Hardware/PCB/precadsr_aux_Gerbers/precadsr-B_Paste.gbr.
• 26.16mm x 10.16, SMD, 18K/W, TO-263, D2.
• Parser borrow heavily from github.com/pelletier/go-toml.

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