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BackPitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole straight pin header, 2x17, 2.54mm pitch, 6mm pin length, double rows Surface mounted socket strip SMD 1x15 1.00mm single row Through hole angled socket strip SMD 1x22 2.54mm single row Surface mounted pin header THT 2x24 2.00mm double row surface-mounted straight pin header, 2x19, 2.54mm pitch, double.
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