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DFN-8 SHT3x-DIS (https://www.sensirion.com/fileadmin/user_upload/customers/sensirion/Dokumente/2_Humidity_Sensors/Datasheets/Sensirion_Humidity_Sensors_SHT3x_Datasheet_digital.pdf 24-Lead Plastic DFN (2mm x 3mm) (http://pdfserv.maximintegrated.com/land_patterns/90-0063.PDF 14-lead very thin plastic quad flat, 3.0x4.5mm size, 0.65mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/14L_VDFN_4_5x3_0mm_JHA_C041198A.pdf DE Package; 16-Lead Plastic Shrink Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN 4-Lead Plastic Stretched Small Outline Package (MS) [MSOP], variant of MSOP-16 (see http://cds.linear.com/docs/en/datasheet/3630fd.pdf 12-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_24_05-08-1864.pdf DKD Package; 24-Lead Plastic QFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (3mm x 3mm) (see Linear Technology 05081955_0_DHC18.pdf DHD Package; 16-Lead Plastic Shrink Small Outline (SS)-5.30 mm Body [LFCSP], (see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_20_6.pdf LFCSP, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T1655-4)), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-148 , 18 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-130-02-xxx-DV-BE-A, 30 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection, for 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py SSOP48: plastic shrink small outline package; 16 leads; body width 4.4 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf HTSSOP, 38 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_38_05-08-1750.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 2 times 2.5 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter 3.5mm, size 7x7.6mm^2, drill diamater 1.3mm, pad diameter 3mm, see , script-generated with , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block Metz Connect Type059_RT06306HBWC, 6 pins, pitch 3.5mm, size 17.5x7.6mm^2, drill diamater 1.4mm, pad diameter 2.6mm, see http://www.farnell.com/datasheets/2138224.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block Phoenix PT-1,5-4-3.5-H pitch 3.5mm size 14x7.6mm^2 drill 1.2mm pad 2.4mm Terminal Block WAGO 236-608 45Degree pitch 5mm size 10x7.6mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00298 pitch 10mm size 65x8.1mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00298, 2 pins, pitch 5mm, size 15x12.6mm^2, drill diamater 1.3mm, pad diameter 2.1mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00232_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block connector Terminal Block Phoenix MKDS-3-15-5.08 pitch 5.08mm size 10.2x8.45mm^2 drill 1.1mm pad 2.1mm terminal block RND 205-00301 pitch 10mm size 45x9mm^2 drill 1.3mm pad 2.6mm terminal block Metz Connect Type059_RT06306HBWC, 6 pins, pitch 10mm, size.

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