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HLE-141-02-xx-DV-TE, 41 Pins per row (http://www.molex.com/pdm_docs/sd/530480210_sd.pdf), generated with kicad-footprint-generator Molex PicoBlade series connector, LY20-42P-DLT1, 21 Circuits (http://www.molex.com/pdm_docs/sd/5022502191_sd.pdf), generated with kicad-footprint-generator Hirose series connector, B7B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: 26-60-4100, 10 Pins per row (https://www.hirose.com/product/en/products/DF63/), generated with kicad-footprint-generator Tantalum Capacitor SMD AVX-H (3528-15 Metric), IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator Hirose DF12E SMD, DF12E3.0-14DP-0.5V, 14 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Mounting Hardware, inside blind hole M1.6, height 6, Wuerth electronics 9771060360 (https://katalog.we-online.com/em/datasheet/9771060360.pdf), generated with kicad-footprint-generator JST ZE series connector, 202396-0807 (http://www.molex.com/pdm_docs/sd/2023960207_sd.pdf), generated with kicad-footprint-generator Molex PicoBlade Connector System, 43045-0800 (alternative finishes: 43045-140x), 7 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-2P-1.25DSA%2850%29/), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 48 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/48L_VQFN_6x6mm_6LX_C04-00494a.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 8-Lead Very Thin Dual Flatpack No-Lead (LZ) - 2x3x0.9 mm Body [TSSOP] with exposed pad 8-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf sensor pressure ssop 98ARH99089A pressure sensor with stainless steel cap Egg with 42x60mm Body-Size, ClassA, according to land-pattern PL-005, including GND vias (https://ww2.minicircuits.com/pcb/98-pl012.pdf Mini-Circuits top-hat case DB1627 (https://ww2.minicircuits.com/case_style/DB1627.pdf Footprint for Mini-Circuits case QQQ130 (https://ww2.minicircuits.com/case_style/QQQ130.pdf) following land pattern drawing: https://ww2.minicircuits.com/pcb/98-pl094.pdf Footprint for the maximum extent possible, whether at the top (mm h_margin = thickness*2; v_margin = hole_dist_top*2; left_rib_x = 0; right_rib_x = width_mm - thickness*2; // draw panel, subtract holes // label the whole thing? // top/bottom ribs? // top right [left_edge + height * rotate_vector_cos, rotate_vector_sin * height], // top left [left_edge, 0], // drop to axis [left_edge, -extra_depth], // top horizontal rib // h_wall(h=1.6, l=right_rib_x); // bottom horizontal rib // h_wall(h=4, l=right_rib_x); // one more vertical to mount a circuit outside the full dev board (in some cases) Arduino + DAC https://www.youtube.com/watch?v=t3kUPjdiq0o for explainer https://drive.google.com/drive/folders/156nn9rClRLJplS4M46s56-Pibi86Z-Kp for schematics and .ino file.

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