Labels Milestones
BackWafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g031y8.pdf ST WLCSP-20, ST die ID 483, 3.73x4.15mm, 115 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 472.
- Bourns, SRF1260, 12.5mmx12.5mm (Script.
- 8.495575e-001 2.095909e-001 vertex 3.738381e-002 -4.684811e+000 2.473857e+001 facet.