3
1
Back

DFN12, 4x4, 0.65P; CASE 506CE (see ON Semiconductor 506AF.PDF DKD Package; 24-Lead Plastic QFN (4mm x 3mm) (see Linear Technology DFN_24_05-08-1864.pdf DKD Package; 24-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed.

New Pull Request