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BackHttp://www.st.com/resource/en/datasheet/stm32f302vc.pdf WLCSP-100, 10x10 raster, 8x8mm package, pitch 0.4mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l496wg.pdf ST WLCSP-132, ST die ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments EUK 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), SMDSocket, SmallPads 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 6-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size 9.78x32.66mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf.
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