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Package; 8 leads; body width 4.4 mm; Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf DFN package size 69.98x30x15.64mm, https://silvertel.com/images/datasheets/Ag5810-datasheet-IEEE802_3bt-Power-over-Ethernet-4-pair-PD.pdf DCDC-Converter Silvertel Ag5810 single output POE DCDC-Converter, 60W POE, Silvertel, pitch 2.54mm, package size 11.6x8.5x10.4mm^3, https://www.recom-power.com/pdf/Innoline/R-78Exx-0.5.pdf DCDC-Converter, RECOM, RECOM_R5xxxDA, SIP-12, Horizontally Mounted, pitch 2.54mm, drill diameter 0.8mm Test point with 2 copper strip, labeled with numbers SMD Solder 3-pad Jumper, 1x1.5mm rounded Pads, 0.3mm gap, open SMD Solder Jumper, 1x1.5mm Triangular Pads, 0.3mm gap, bridged with 2 copper strips SMD Solder Jumper, 1x1.5mm rounded Pads, 0.3mm gap, bridged with 2 pins, pitch 5mm, size 25x10mm^2, drill diamater 1.3mm, pad diameter 2.1mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for a full checkout.

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