synth_tools

Back

Mounting Hardware, inside blind hole M1.6, height 2.5, Wuerth electronics 9771140360 (https://katalog.we-online.com/em/datasheet/9771140360.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 4.5mm, height 8, Wuerth electronics 9774020482 (https://katalog.we-online.de/em/datasheet/9774020482.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 3x3 (perimeter) array, NSMD pad definition Appendix A Spartan-7 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition Appendix A BGA 484 0.8 SB484 SBG484 SBV484 Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=302, NSMD pad definition Appendix A BGA 238 0.5 CPG238 Spartan-7 BGA, 15x15 grid, 13x13mm package, pitch 0.4mm; see section 7.3 of http://www.st.com/resource/en/datasheet/stm32l011k3.pdf WLCSP-36, 6x6 raster, 2.61x2.88mm package, pitch 0.8mm; see section 7.6 of http://www.st.com/resource/en/datasheet/DM00257211.pdf WLCSP-64, 8x8 raster, 4.466x4.395mm package, pitch 0.8mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00284211.pdf WLCSP-104, 9x12 raster, 4.095x5.094mm package, pitch 0.4mm; see section 6.6 of http://www.st.com/resource/en/datasheet/DM00273119.pdf X1-WLB0909, 0.89x0.89mm, 4 Ball, 2x2 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/tps63000.pdf 3x3mm Body, 0.5mm Pitch http://www.st.com/resource/en/datasheet/ecmf02-2amx6.pdf UQFN DFN 0.5 Qorvo 2x2mm DFN package size 11.5x8.5x17.5mm^3, https://www.recom-power.com/pdf/Innoline/R-78HBxx-0.5_L.pdf DCDC-Converter, RECOM, RECOM_R-78S-0.1, SIP-4, pitch 2.54mm, size 28.4x6.2mm^2, drill diamater 1.3mm, pad diameter 2.6mm, see http://www.farnell.com/datasheets/100425.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block Metz Connect Type094_RT03504HBLU, 4 pins, single row Through hole angled pin header THT 1x36 2.00mm single row style1 pin1 left Surface mounted pin header THT 2x29 2.00mm double row Through hole straight pin header, 2x26, 2.00mm pitch, 6.35mm socket length, double cols (from Kicad 4.0.7), script generated Through hole straight Samtec HPM power header series 11.94mm post length THT 1x04 2.00mm single row Through hole angled pin header, 1x23, 1.27mm pitch, 4.4mm socket length, single row (from Kicad 4.0.7!), script generated Through hole angled socket strip SMD 2x39 2.54mm double row Through hole angled socket strip, 2x40, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole.

New Pull Request

Labels Milestones