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Thin shrink small outline package; 16 leads; body width 5.3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf STC SOP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_22.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-1230, 12 Pins per row (http://www.molex.com/pdm_docs/sd/022035035_sd.pdf), generated with.

• DEF SW_DPST SW 0.
• 0 7.50886 vertex 6.35535 0.201366 7.51116 facet normal.

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