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1x08 5.08mm single row style1 pin1 left Surface mounted pin header SMD 1x16 1.27mm single row Through hole pin header THT 2x30 2.00mm double row Through hole pin header SMD 1x16 1.27mm single row Surface mounted pin header SMD 2x17 1.00mm double row Through hole pin header THT 1x13 1.00mm single row Surface mounted pin header THT 2x33 2.00mm double row Through hole angled pin header, 2x19, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 1x18, 1.27mm pitch, 4.4mm socket length, single row style1 pin1 left Surface mounted socket strip THT 1x39 2.00mm single row Through hole angled pin header SMD 1x10 1.00mm single row Through hole angled pin header SMD 2x26 1.27mm double row Through hole socket strip THT 2x09 2.00mm double row Through hole socket strip THT 2x32 2.54mm double row surface-mounted straight socket strip, 2x05, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip THT 2x11 1.27mm double row Through hole pin header SMD 1x20 1.00mm single row male, vertical entry connector Molex KK-396 horizontal Molex KK 396 Interconnect System, old/engineering part number: 22-27-2041, 4 Pins (http://www.molex.com/pdm_docs/sd/022272021_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP I, 32 pins, through hole 3.3mm, height 8, Wuerth electronics 9774080243 (https://katalog.we-online.de/em/datasheet/9774080243.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-131-02-xxx-DV, 31 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 52991-0208, 20 Pins (http://www.molex.com/pdm_docs/sd/555600207_sd.pdf), generated with kicad-footprint-generator JST PUD series connector, 53780-0270 (), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-112-02-xx-DV-TE, 12 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 20-Pin Plastic Quad Flat, No Lead Package (UC) - 3x3x0.5 mm Body [WSON], http://www.ti.com/lit/ml/mpds421/mpds421.pdf WSON-16 3.3 x 1.35mm Pitch 0.4mm 8-Lead Plastic DFN (3mm x 2mm) (see Linear Technology 05081955_0_DHC18.pdf DHD Package; 16-Lead Plastic Small Outline Package (MS) [MSOP], variant of 8-Lead Plastic Dual Flat No Lead Package (UC) - 3x3x0.5 mm Body [WSON], http://www.ti.com/lit/ml/mpds421/mpds421.pdf WSON-16 3.3 x 1.35mm Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, NSMD pad definition Appendix A BGA 1924 1 FL1925 FLG1925 FL1926 FLG1926 FL1928 FLG1928 FL1930 FLG1930 Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=78, NSMD pad definition Appendix A BGA 1760.

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