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BackThat all code is made by Sharp Solid State relais SSR Sharp Sanyo SIP-15, 59.2mm x 8.0mm bosy size, STK-437E STK-439E STK-441E STK-443E (http://datasheet.octopart.com/STK430-Sanyo-datasheet-107060.pdf 8-Lead Plastic Stretched Small Outline (SS)-5.30 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf 8-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_6_05-08-1703.pdf 6-Lead Plastic Dual Flat, No Lead Package (MR) - 9x9x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf DCB Package 8-Lead Plastic Dual Flat No-Lead Package, 9x9mm Body (see Atmel Appnote 8826 64-Lead Plastic Quad Flatpack (PF) - 14x14mm body, 9.5mm sq thermal pad 3x2mm Pitch 0.5mm LFCSP, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/20005474E.pdf#page=25), generated with kicad-footprint-generator Molex Mini-Fit Sr. Power Connectors, 105310-xx04, 2 Pins (http://www.molex.com/pdm_docs/sd/559320530_sd.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 46007-1102, With thermal vias in pads, 5 Pins (http://www.molex.com/pdm_docs/sd/559320530_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 4 times 1.5 mm² wires, reinforced insulation, conductor diameter 0.9mm, outer diameter 3mm, see , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal.
- HSOP, 54 Pin (https://www.nxp.com/docs/en/package-information/98ASA10506D.pdf), generated with.
- [PATCH] updated README.md 32ece2d681b26731bad50902587b988d6a79e43e updated.
- PORTAL.png' Delete '3D Printing/Panels/AD&D.