3
1
Back

DFN22 6*5*0.9 MM, 0.5 P; CASE 506AF\xe2\x88\x9201 (see ON Semiconductor 506CE.PDF DD Package; 8-Lead Plastic DFN (2mm x 2mm), http://ams.com/eng/content/download/950231/2267959/483138 DD Package; 8-Lead Plastic Dual Flat No-Lead Package, 3x3mm Body (see Microchip Packaging Specification 00000049BS.pdf QFN, 64 Pin (www.intel.com/content/www/us/en/ethernet-controllers/i210-ethernet-controller-datasheet.html), generated with kicad-footprint-generator Resistor SMD 01005 (0402 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.vishay.com/docs/20056/crcw01005e3.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-120-02-xxx-DV-A, 20 Pins (https://www.molex.com/pdm_docs/sd/537480308_sd.pdf), generated with kicad-footprint-generator Hirose DF13 through hole, DF11-4DP-2DSA, 2 Pins per.

New Pull Request