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1000mil LongPads 40-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 18-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 5-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 24-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils THT DIP DIL PDIP SMDIP 2.54mm 9.53mm 375mil.

• CASCADE out Period: 1.
• 0.68155 0.725012 0.0992371 vertex 6.37424 -7.70513 0.
• -1.064903e-14 -1.000000e+00 -1.490231e-14 facet.
• GMSTBV_2,5/9-GF-7,62; number of pins: 08; pin pitch: 5.08mm.

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