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Series, Taiyo-Yuden_MD-3030, 3.0mmx3.0mm Inductor, Taiyo Yuden, MD series, Taiyo-Yuden_MD-2020, 2.0mmx2.0mm Inductor, Taiyo Yuden, NR series, Taiyo-Yuden_NR-10050, 9.8mmx10.0mm, https://ds.yuden.co.jp/TYCOMPAS/or/specSheet?pn=NR10050T1R3N Inductor, Traco, TCK-047, 5.2x5.8mm, https://www.tracopower.com/products/tck047.pdf Choke, SMD, 4.0x4.0mm 2.1mm height, https://www.tracopower.com/products/tck141.pdf Low Profile, High Current Inductor, body 41x36mm, https://www.we-online.com/catalog/en/WE-HCFT#/articles/WE-HCFT-3540 3.2mm x 2.8mm PLCC4 RGB LED, clear, SMD, https://www.lumex.com/spec/SML-LX0303SIUPGUSB.pdf Lumex RGB LED, through hole, DF63M-1P-3.96DSA, 1 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-134-02-xxx-DV-LC, 34 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41792-0013 example for new part number: 26-60-5030, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST SH series connector, B05B-ZESK-D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 20-Pin Plastic Quad Flat, No Lead Package (UC) - 3x3x0.5 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 18-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils SMD DIP DIL ZIF 25.4mm 1000mil SMDSocket SmallPads 4-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 12-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil Socket 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 10-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 4x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 42-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 8-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket THT DIP DIL PDIP 2.54mm 15.24mm 600mil 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 5x-dip-switch SPST CTS_Series194-5MSTN, Piano, row.

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